Resilience Assessment of China's Embeddedness in the Global Innovation Network of the High-End Chip Industry:A Dual Perspective of Static Structure and Dynamic Shocks

Resilience Assessment of China's Embeddedness in the Global Innovation Network of the High-End Chip Industry:A Dual Perspective of Static Structure and Dynamic Shocks

Zhang Qing,Gao Zhan

Science & Technology Progress and Policy ›› 2026, Vol. 43 ›› Issue (12) : 72-83.

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Science & Technology Progress and Policy ›› 2026, Vol. 43 ›› Issue (12) : 72-83. DOI: 10.6049/kjjbydc.D12025100679

Industrial Innovation Development

Resilience Assessment of China's Embeddedness in the Global Innovation Network of the High-End Chip Industry:A Dual Perspective of Static Structure and Dynamic Shocks

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 43(12): 72-83 https://doi.org/10.6049/kjjbydc.D12025100679

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