The Collaborative Mechanism of Key and Core Technology Innovation:An Empirical Research Using Chip Lithography as An Example
Zhang Beibei1,Li Cunjin1,Yin Ximing1,2
(1.School of Management and Economics, Beijing Institute of Technology, Beijing 100081, China;2.Research Center for Technological Innovation, Tsinghua University, Beijing 100084, China)
张贝贝,李存金,尹西明. 关键核心技术产学研协同创新机理研究——以芯片光刻技术为例[J]. 科技进步与对策, 2023, 40(1): 1-11.
Zhang Beibei,Li Cunjin,Yin Ximing. The Collaborative Mechanism of Key and Core Technology Innovation:An Empirical Research Using Chip Lithography as An Example. SCIENCE & TECHNOLOGY PROGRESS AND POLICY, 2023, 40(1): 1-11.
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